Source
Intel’s U.S. Advanced Packaging Enables Next-Generation AI Semiconductors
Intel Foundry is utilizing advanced packaging technologies, including Foveros and EMIB, at its New Mexico facilities to interconnect specialized chiplets. This process enables the creation of high-performance semiconductors designed to power massive AI workloads.
Why it matters
These advancements lead to more powerful AI data centers and consumer electronics with thinner designs and longer battery life. It allows hardware to handle complex AI tasks more efficiently than single, massive chips.
The details
- New Mexico packages scale to 8x industry standard, and 12x by 2028.
- EMIB-T, introduced in 2026, delivers power directly to chips for better efficiency.
- Foveros connects specialized chiplets on a silicon interposer to increase performance.
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